Global Sourcing OEM Limited is a global supply chain solutions company in the industry of electronic components. Our strong brands: TI, ADI/LT, ST, Maxim, Cypress, Altera and Microchip

News Center-Global Sourcing OEM Limited

Apple’s quarterly revenue fell for the first time in four years, and iPhone revenue fell by 8% year-on-year

1. Apple’s quarterly revenue fell for the first time in four years, and iPhone revenue fell by 8% year-on-year

According to Fast Technology, Apple handed over a “disappointing” financial report, with revenue declining for the first time since 2019. Apple’s total net sales in the first fiscal quarter of 2023 (corresponding to Q4 in 2022) were US$117.154 billion, a year-on-year decrease of 5%; net profit was US$29.998 billion, a year-on-year decrease of 13%.

The financial report shows that Apple’s first-quarter iPhone net sales were US$65.775 billion, a year-on-year decrease of 8%, and revenue sources accounted for 56.1% of the total; Mac and wearable devices/home products/accessories also fell by 29% and 8% respectively ; iPad business grew 30% to $9.4 billion.

In the first fiscal quarter, Apple’s revenue in Greater China was US$23.905 billion, a year-on-year decrease of 7%. Still, revenue in Greater China beat analysts’ expectations of $21.8 billion. Cook also said in the interview that based on constant exchange rates, the performance of Greater China should actually grow.


2. Cloud service providers reduce server purchases, and the supply chain is expected to turn conservative

According to Taiwan’s Electronic Times quoted by the Science and Technology Board Daily, not only PCs and mobile phones are still in the process of destocking, but the growth momentum of the server industry, which previously shouldered the heavy responsibility of rescuing the market, has unexpectedly slowed down.

Including Meta, Amazon, Microsoft, and Google have continuously revised their 2023 annual server forecast orders in recent months, among which Meta and Amazon have the biggest changes. According to the server supply chain, there may be fluctuations in the short term, but it is still optimistic in the long term. Although the US cloud data center customers have recently changed from being super optimistic to relatively conservative, they will still show growth compared to 2022.


3. Gartner: Global PC shipments will drop by 7% in 2023

According to IT House, market research firm Gartner released its latest report on Tuesday, predicting that global PC and mobile phone shipments will decline for the second consecutive year in 2023, of which mobile phone shipments will fall to the lowest point in a decade .

Gartner predicts that global device shipments (including PCs, tablets, and mobile phones) will be 17 units in 2023, a year-on-year decrease of 4.4%. In 2022, it will decrease by 11.9% year-on-year. The agency estimates that global smartphone shipments will be 1.23 billion units in 2023, down from 1.28 billion units in 2022, a year-on-year decrease of 4%.

The report also mentions that PC shipments will decline by 7% in 2023 after falling by 16% in 2022. PC inventory levels will return to normal in the second half of 2023. The replacement cycle of all equipment will be extended from 6 months to more than 9 months.


4. BAIC Group and Bosch signed a strategic cooperation agreement to deepen cooperation in intelligent technology

BAIC Group announced on February 1 that it signed a strategic cooperation agreement with Bosch China. Based on the long-term good cooperation foundation established in the past, under the trend of accelerated restructuring of China’s smart car value chain, the two parties will continue to expand and enrich car usage scenarios, and build comprehensive and in-depth strategic cooperation in the fields of smart cockpit, smart driving, and smart networking.

It is reported that in line with the general trend of electrification, networking, and intelligence, BAIC has formed a first-mover advantage in related fields, and will propose more solutions in the fields of smart cockpit, smart driving, and smart networking through cooperation with Bosch. Bosch will provide BAIC with more intelligent and competitive products based on its safe and reliable smart driving solutions developed in six dimensions: system, functional safety, data, chips, hardware, and algorithms.


5. Liu Yangwei, chairman of Hon Hai: plans to set up an electric vehicle parts factory in Europe

According to a report from Taiwan Economic Daily quoted by IT House, Hon Hai Chairman Liu Yangwei revealed yesterday that he is planning to set up an electric vehicle component factory in Europe for the first time, and will go to the United States to sign contracts with customers from March to April, and may announce during the period New plans for the factory in Wisconsin, USA, and a visit to the Mexican factory.

In terms of model planning, Liu Yangwei said that this year’s Hon Hai Technology Day will definitely launch new models. Specifically, the Hon Hai Group originally had ICT-related factories in several places in Europe. It will go to Europe for the first time to set up electric vehicle-related factories. The first step is to lock in electric vehicle components. The parts factory will be a little faster.


6. UMC and Cadence jointly develop 3D-IC hybrid bonding reference flow

On February 1, the wafer foundry UMC and the EDA giant Cadence jointly announced that the 3D-IC reference flow centered on the latter’s Integrity 3D-IC platform has passed the certification of UMC’s chip stack technology, helping the industry to speed up time-to-market.

The cooperation between the two parties on wafer-to-wafer stacking technology adopts UMC’s 40nm low-power process, and uses the Cadence Integrity 3D-IC platform to verify the key 3D-IC functions in the design process, including system planning and smart bump design. create.

7. Toshiba launches new automotive N-channel power MOSFET

A few days ago, Toshiba Electronic Devices & Storage Corporation announced the launch of automotive 40V N-channel power MOSFETs—XPQR3004PB and XPQ1R004PB—in a new L-TOGL (Large Transistor Outline Gull-Wing Lead) package. These two MOSFETs feature high rated drain current and low on-resistance. Products start shipping today.

With new packaging technology, the new products can further simplify thermal design and significantly reduce the number of MOSFETs required for high-current applications such as semiconductor relays and integrated starter-generator inverters, thereby helping the system reduce device size.