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ON Semiconductor launches 3 SiC-based automotive power modules for on-board chargers

APM32 series modules enable faster charging and longer range for all types of electric vehicles

September 29, 2022 – ON Semiconductor (ONSEMI, NASDAQ: ON), a leader in smart power and smart sensing technologies, today announced the launch of three silicon carbide (“SiC”)-based power modules , using die casting technology for on-board charging and high voltage (hereafter “HV”) DCDC conversion of all types of electric vehicles (hereafter “xEV”). The APM32 series is an industry-first that combines SiC technology and die-cast mold packaging to improve energy efficiency and reduce xEV charging time, and is designed for high-power on-board chargers (“OBC”) from 11 kW to 22 kW.


All three modules exhibit low conduction and switching losses combined with best-in-class thermal resistance and high-voltage isolation to handle 800 V bus voltages. Higher energy efficiency and less heat ultimately make OBC more powerful. It enables faster charging and longer range of xEVs, two key factors that consumers place a premium on.


Fabio Necco, vice president and general manager of automotive power solutions at ON Semiconductor, said: “Our new modules utilize the latest SiC technology to minimize losses and overall system size, enabling designers to achieve their goals of improved charging efficiency and space savings.” Using a preconfigured block format, people can configure their designs faster, dramatically reducing time to market and design risk.”


With ON Semiconductor’s end-to-end SiC supply chain capabilities and proven SiC MOSFETs and diodes, the APM32 modules are highly reliable and each module is serialized for full traceability. These modules operate at junction temperatures (Tj) up to 175°C, ensuring reliability even in challenging, space-constrained automotive applications.


Simon Keeton, executive vice president and general manager of ON Semiconductor’s Power Solutions Division, said: “The APM32 provides customers with a differentiated solution that leverages the capabilities of cutting-edge SiC technology in ON Semiconductor’s best-in-class packaging. In addition, we know our customers There is an emphasis on supply assurance, and our end-to-end SiC supply chain capabilities can provide that assurance.”

 

The two modules of the APM32 series, NVXK2TR40WXT and NVXK2TR80WDT, use an H-bridge topology with a breakdown (V(BR)DSS) voltage of 1200 V, thus ensuring suitability for high-voltage battery packs. They are designed for OBC and HV DCDC transition sections. The third module, the NVXK2KR80WDT, uses a Vienna rectifier topology for the power factor correction (PFC) section of the OBC. 6-pack modules and full-bridge modules will also be launched soon to complete the SiC OBC product portfolio.


All three modules are packaged in a small, robust dual-in-line package (DIP), which ensures low module impedance. Top water cooling and isolation meet the strictest automotive industry standards. Creepage distances and clearances comply with IEC 60664-1 and IEC 60950-1. Additionally, the modules are AEC-Q101 and AQG 324 qualified.

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